Computer Integrated Electronics Manufacturing and Testing

Describes this process at it relates to the electronics industry, focusing on such areas as printed wiring boards, networking, automatic assembly, surface mount technology, tape automated bonding, bar coding, and electro-static discharge. Also studies the effects of group work ethics as a factor in

Jack Arabian is Manager of Process Technology Assessment at Digital Equipment Corporation in Andover, Massachusetts. Previously he has worked as an electronics designer, systems designer, manufacturing engineer, and test engineer at such corporations as Westinghouse, MIT Instrumentation Laboratories (now called C.S. Draper Labs), Polaroid, Northrop, and Foxboro. Mr. Arabian has written many papers for test and design conferences in the U.S. and abroad, has received awards from the Institute of Electrical and Electronics Engineers (IEEE) and the British Society of Test Engineers, of which he is a member, and is an editorial board member of the Journal of Electronics Testing: Theory and Applications and Design and Test of Computers. Among the numerous professional societies he belongs to are the Institute of Quality Assurance and IEEE. Mr. Arabian received the A.B. degree (1951) in engineering sciences and applied physics from Harvard University, Cambridge, Massachusetts, and M.S. degree (1970) in aeronautical and astronautical sciences from the Massachusetts Institute of Technology, Cambridge.

Introduction 1 the printed wiring board open brackets PWB close brackets in electronics manufacturing 2 Solder and Automated Soldering Processes 3 Automated Assembly Techniques 4 ESD (Electrostatic Discharge) 5 Bar Coding and Other Marking Systems 6 Manufacturing test 7 computer assisted relay 8 Networking for electronics manufacturing 9 Surface mount technology [SMT] and take automated 10 Artificial intelligence and expert systems in manufacturing 11 Kaisha and electronics manufacturing 12 Waves of opportunity